45°C Phase Change with Ultra-Low Thermal Impedance—Engineered for Next-Gen High-Power Applications.
Zero siloxane contamination for reliable operation of aerospace equipment in extreme environments.
Tested through long-term thermal cycling and coolant immersion, ideal for high-performance computing and advanced liquid cooling applications.
Developed through years of R&D and hundreds of validation tests, delivering a reliable thermal management solution for high-heat electronic components.
45°C Phase Change with Ultra-Low Thermal Impedance—Engineered for Next-Gen High-Power Applications.
Zero siloxane contamination for reliable operation of aerospace equipment in extreme environments.
Tested through long-term thermal cycling and coolant immersion, ideal for high-performance computing and advanced liquid cooling applications.
Developed through years of R&D and hundreds of validation tests, delivering a reliable thermal management solution for high-heat electronic components.
For High-Power Electronics
For Precision Electronics & Aerospace
technologies
In an era defined by AI, HPC, EVs,LEO satellites, and next-gen communication, thermal management is vital to product performance and reliability. LiPOLY (Shiu Li Technology) specializes in world-class Thermal Interface Materials (TIMs) and custom thermal solutions. We help global clients overcome heat challenges and elevate product competitiveness. Beyond a supplier, we are your trusted innovation partner, engineering the future of thermal management together.
NEW PROUDCTS

Ultra3065 導熱係數達 30.0 W/m·K,具備優異的壓縮性與貼合性,可適應元件高度差異及不平整表面;Shore OOO 70 硬度兼顧貼合與支撐。
其介電擊穿強度達 9 KV/mm,厚度與尺寸皆可客製,適用於 AI 伺服器、GPU、CPU、HBM 封裝及電源模組等高功率應用。

LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45°C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.

This product is a high thermal conductivity liquid material designed for AI chip cooling, offering excellent gap-filling capability and heat-curable properties to effectively reduce junction temperatures in high-performance computing systems. Its stable material structure makes it an ideal thermal interface material for immersion cooling, maintaining consistent thermal performance under prolonged liquid exposure and thermal cycling conditions.
In addition, this heat-curable liquid TIM for EV applications is engineered to withstand long-term thermal cycling, making it suitable for electric vehicles and other high-load operating environments. It delivers a reliable thermal management solution for advanced electronics and automotive applications requiring long-term stability and high reliability.

DTT54-s features a thermal conductivity of 4.0 W/m·K and provides a structurally stable, high-performance thermal interface layer. It is designed for use between chips and cold plates or other heat dissipation structures, forming a low thermal interface resistance and a long-term reliable heat transfer path to effectively reduce junction temperatures. Even under prolonged immersion in cooling fluids, the material resists loss, displacement, and performance degradation, ensuring stable and reliable thermal performance during long-term operation.

Ultra3065 導熱係數達 30.0 W/m·K,具備優異的壓縮性與貼合性,可適應元件高度差異及不平整表面;Shore OOO 70 硬度兼顧貼合與支撐。
其介電擊穿強度達 9 KV/mm,厚度與尺寸皆可客製,適用於 AI 伺服器、GPU、CPU、HBM 封裝及電源模組等高功率應用。

LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45°C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.
旭立的技術團隊來自不同領域的頂尖人才組成,專注於開發高性能導熱和創新的材料
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industries
industries
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旭立的技術團隊來自不同領域的頂尖人才組成,專注於開發高性能導熱和創新的材料
Certification
LiPOLY's interface thermal conductive materials feature a comprehensive quality management system and have obtained global certifications.
16949
Published
2016

Provides a quality management system for continuous improvement, defect prevention, and reduction of variation and waste within the automotive industry supply chain operations.
RBA
Published
2015

Responsible Business Alliance Code of Conduct ensuring compliance with labor rights, environmental protection, and business ethics standards for sustainable electronics supply chains.
45001
Published
2018

透過系統化管理職業安全與健康風險,預防工作傷害與疾病,持續改善工作場所安全。
ROHS
Published
2023

European Union directive designed to restrict the use of certain hazardous substances in electrical and electronic equipment to protect human health and environmental safety.
REACH
Published
2007

Requires manufacturers and importers to demonstrate that their chemical substances are safe for health and environment, replacing high-concern substances when necessary for safety.
UL 94
Published
2023

Plastic material flammability testing standard developed by Underwriters Laboratories, widely used for evaluating the flame retardant performance of various plastic materials.
About us
We believe that thermal conductivity is not just a technology but an innovative revolution. Our products combine technology and uniqueness, injecting boundless power into your products.
Continuously investing in key industrial technologies, showcasing top-notch R&D capabilities, and creating greater value for the future.
LiPOLY's interface thermal conductive materials feature a comprehensive quality management system and have obtained global certifications.
The global demand for thermal conductivity is growing exponentially, driving rapid advancements in thermal management technologies.
With the explosive growth in computational demands across applications and the surge in demand for AI devices, major companies worldwide are intensifying procurement efforts to stay competitive. In this context, thermal management has become critical to ensuring stable and efficient operations.
Frank Jian
General Manager
Thermal Solutions Expert
SHIU LI TECHNOLOGY CO., LTD.
Taoyuan City, Bade District, Yongfeng Road, No. 435
Contact Us
Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.


